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thermal profile

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  • Thermal contact conductance — In physics, thermal contact conductance is the study of heat conduction between solid bodies in thermal contact. The thermal contact conductance coefficient, hc, is a property indicating the thermal conductivity, or ability to conduct heat,… …   Wikipedia

  • Thermal conductivity measurement — Two classes of methods exist to measure the thermal conductivity of a sample: steady state and non steady state methods. Steady state methods (In Geology/Geophysics)The most common method for consolidated rock samples is the Divided Bar. There… …   Wikipedia

  • thermal melting profile — In general a record of the phase state of a system over a temperature range. Phase changes can be detected by exothermy or endothermy. Valuable in studying lipid and DNA structures …   Dictionary of molecular biology

  • Solar thermal collector — A solar thermal collector is a solar collector specifically intended to collect heat: that is, to absorb sunlight to provide heat. Although the term may be applied to simple solar hot water panels, it is usually used to denote more complex… …   Wikipedia

  • Soil thermal properties — The thermal properties of soil are a component of soil physics that has found important uses in engineering, climatology and agriculture. These properties influence how energy is partitioned in the soil profile. While related to soil temperature …   Wikipedia

  • Paleocene–Eocene Thermal Maximum — The Paleocene/Eocene boundary, Ma|eocene, was marked by the most rapid and significant climatic disturbance of the Cenozoic Era. A sudden global warming event, leading to the Paleocene Eocene Thermal Maximum (PETM, alternatively nowrap| Eocene… …   Wikipedia

  • Process Window Index — The Process Window Index is a quantifiable, reproducible, statistical measure of how well a thermal profile performs relative to critical process limits. Every thermal profile is ranked on the basis of how it fits within the process window. The… …   Wikipedia

  • Friction stir welding — (FSW) is a solid state joining process (meaning the metal is not melted during the process) and is used for applications where the original metal characteristics must remain unchanged as far as possible. This process is primarily used on aluminum …   Wikipedia

  • Reflow soldering — is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily hold the components to their attachment pads, after which the assembly is carefully heated in order to solder the joint. The assembly may… …   Wikipedia

  • Humid continental climate — worldwide   Dsa …   Wikipedia

  • Conformal coating — material is applied to electronic circuitry to act as protection against moisture, dust, chemicals, and temperature extremes that, if uncoated (non protected), could result in damage or failure of the electronics to function. When electronics… …   Wikipedia

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